Information & Services
Lead packages Leadless packages MEMS & Sensor
PCBA-Micro Assembly
Hospitality & Security Access Controls Building Management-Networking-IoT Automotive & Medical Products
Automotive & Medical Products







Hospitality & Security Access Controls






IC Assembly

Package
SOT23 TO series
TSOT23 11 ZIP
SC70 QFN
SC82 DFN
MSOP MEMS
SD Card SON6C

IC Assembly

Lead packages

Package POD (in mm) Lead Count Available
MSOP 3.0 x 3.0 x 0.85 8 10
SC70 2.0 x 1.25 x 0.95 5 6
SC82 2.0 x 1.25 x 0.95 4
SOT23 2.9 x 1.6 x 1.2 3 5 6 8
TSOT23 2.9 x 1.6 x 0.75 3 5 6
11ZIP 20.01x10.975 11
SON6C 1.6x1.6 6

Lead packages

Leadless packages

Package : DFN

Package Thickness Available: 0.45mm, 0.55mm, 0.75mm, 0.90mm

POD (in mm) Pin Count Available
0.6x1.0 2 3
1.0x1.0 4
1.1x0.7 6
1.2x1.0 6
1.4x1.4 6
1.45x1.0 6
1.5x1.0 6
1.5x1.5 6 8
1.57x2.1 6 6
1.6x1.6 6
1.6X4.0 2
1.8x2.0 6
1.97x2.46 8
2.0x1.8 6
2.0x2.0 6 8 10
2.5x1.0 10
2.5x4.0 12
3.0x2.0 8 14
3.0x2.5 14
3.0x3.0 10 12
3.5x1.35 14
3.5x2.5 12 16
3.5x4.5 8
4.0x2.5 12 16
4.0x4.0 8 14
4.0x6.0 10
5.0x5.0 8
5.0x7.0 8
6.0x6.0 8
9.0x4.0 36
Package : cQFN

Package Thickness Available: 0.45mm, 0.55mm, 0.75mm, 0.90mm

POD (in mm) Pin Count Available
5x5x0.9 32
6x6x0.9 24
7x7x0.9 28
Package : QFN

Package Thickness Available: 0.45mm, 0.55mm, 0.75mm, 0.90mm

POD (in mm) Pin Count Available
1.2x1.4 8
1.6x1.6 8
1.8x1.4 10
1.8x1.8 12
2.0x2.0 3 12 14
2.1x1.6 10
2.6x1.8 16
3.0x3.0 12 16
3.5x3.0 12
4.0x3.0 20
4.0x4.0 16 20 28
5.0x4.0 24
6.0x6.0 40
5.0x5.0 12 32
7.0x7.0 48 56
8.0x8.0 80
10.0x10.0 56

Leadless packages DFN,cQFN,QFN

LED Assembly

Automotive LED

General Lighting LED Array


LED Assembly

MEMS & Sensor

Pressure Sensors and Air flow sensors

Customized Package type

MEMS Die and ASIC die in one package


MEMS and Sensor
MEMS and Sensor

Micro PCBA Assembly

DFx Support:

  • Valor NPI Software
  • DFx support
  • NPI Analysis
  • Risk mitigation
  • Mechanical Design
  • PCB-Flex- Flex+PCB substrates

SMT Assembly:

  • MCM/DEK Printer
  • Panasonic/Yamaha P&P
  • KohYoung/ 3D SPI
  • Standard/Vacuum Reflow
  • Omron/Saki 3D AOI
  • 3D x-Ray
  • Package-on-Package (PoP)

COB Assembly:

  • MCM12 Multi-Chip D/A
  • ASM AD828 Die Attach
  • AB559 Wire Bond (Al)
  • Eagle16 Wire Bond (Au)
  • Nordson UV (coating)
  • Dam & Fill

PCBA Assembly:

  • Selective Wave (SEL) Solder
  • Robotic (Quick) Soldering
  • Routing De-panelling
  • Auto Conformal Coating
  • Ultrasonic/Spot Welding
  • Auto Potting Process
  • In-House Tooling Dev’t.

Electrical Testing:

  • In-house Tester Dev’t.
  • Programming
  • Keysight, TRI, Teradyne ICT Test Systems.
  • Functional Testing
  • Flying Probe Testing





Multi-die & Stacked dies

  • Multi-die SOT23
  • Multi-die QFN
  • Multi-die on Substrate
  • Stacked dies



Building Management – Networking – IoT






PCBA-Micro Assembly Functional Testing

In-Circuit Testers
Keysight / HP 3070 Series VI
Teradyne LH-128 High-Speed
MDA HALT-800XP

Flying Probe Testers
iOrange TF-300DA (Top: 4 probes / Bottom: 2 probes)

Functional Testers (In-house Test Development )
Automotive Lighting, sensors, etc.
Medical Hearing aids, Test kits, Airflow, etc..
Industrial Remote server, Hipot, Remote Power, Asset Tracking, Pyro sensors, Alarm systems, Door access. etc.
Hospitality/Security RF (3kHz-3.3GHz), WiFi (a/b/g/n/ac/ax), Bluetooth 3.0-5.2, RFID (LF/HF/Combo), LTE (4G) GPS, etc.



Power Discrete Packages

TO247-2L
TO247-2L

TO247-3L
TO247-3L

TO247-4L
TO247-4L

TOLL
TOLL

D2PAK-7L
D2PAK-7L

PQFN88
PQFN88



Power Module Assembly

Package POD (L*W*H))
Easy1B 48*33.8*12
Easy2B 56.7*63.4*12
34mm 94*34*29.6
62mm 106.4*61.4*30.9
Econo2 107.5*45*16.8
Econo3 122*62*20.5
EconoDual3 152*62*17
HP1 140*113*17

Power Module Assembly
Power Module Assembly

RFID Capabilities

  • Muhlbauer DDA-40KP
  • ~40k units per hour per machine total 3 lines machines (expanding 12 lines)
  • Fully automated roll-to-roll RFID Assembly & Testing

RFID

Test system

Device Type Tester Vendor
Mixed Signal STS 8200 ACCOTEST
STS 8107 ACCOTEST
ASL 1000 CREDENCE
AMIDA 1000 AMIDA
AMIDA 3000 AMIDA
Digital Tester MAVERICK NEXTEST
3380D CHROMA
V50 VERIGY
MCT2000 CUSTOMER CONSIGNED
RF Test NETWORK ANALYZER(8GHz) ADVANTEST
NETWORK ANALYZER AGILENT
Others K2611 KEITHLEY
OS tester Macrotest


WLCSP Services

Wafer Probing

Wafer Probing
Wafer Size 150 mm (6”), 200 mm (8”)
Wafer Thickness (min) 200um
Temperature 25 °C to 85 °C
Die Processing Services

WLCSP backend processes from wafer backside grinding to tape & reel and packing

DPS (Backend)
Wafer Size 150 mm (6”), 200 mm (8”)
Saw Street (min) 60 um
Die Thickness (min) 200 um
Die Size 0.4x0.2 to 5.0x5.0 mm
Wafer backside Coating Available
Shipping 7” or 13” reels