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PACKAGING SERVICES
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Package/Lead
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9
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24
28
32
36
40
44
48
56
68
100
PDIP 300 mils
x
x
x
x
x
x
PDIP 600 mils
x
x
x
SOIC 150 mils
x
x
x
SOIC 150 mils
(Exposed Pad)
x
SOIC 208 mils
x
SOIC 300 mils
x
x
x
x
MSOP
x
x
MSOP
(Exposed Pad)
x
x
CMSOP
x
x
QSOP
x
x
x
x
VSOP
x
SC70
x
x
x
SOD723
x
SOT23
(1.3 x 2.9 mm)
x
SOT23
(1.65 x 2.9 mm)
x
x
x
SC59
x
TSOT23
x
x
SOT223
x
x
SOT553 / 563
x
x
SOT89
x
SOT953 / 963
x
x
TO263 (DDPAK)
x
x
TO-92
x
x
PR35
x
DFN 2x2 mm
x
x
x
DFN 3x3 mm
x
x
x
x
DFN 4x3 mm
x
QFN 3x3 mm
x
x
QFN 4x4 mm
x
x
x
QFN 5x5 mm
x
x
x
QFN 6x6 mm
x
x
QFN 7x7 mm
x
x
LGA
x
x
x