Electronic Manufacturing Services - Thailand -Hana Group

   Lamphun manufacturing facility


ELECTRONIC MANUFACTURING SERVICES


Hana Lamphun has two facilities located in Lamphun which is in northern part of Thailand near Chiangmai. The first plant has operated since 1994 mainly produces PCBA/COB/High Precision Microelectronic assembly, where another new factory expansion operated since 2015 allows us to re-locate some existing work from our main plant to support IC production and improves our assembly lay-outs for better efficiency. Our state-of-the-art facilities contain totally over 500,000 square feet manufacturing floor space with ISO9001, ISO/TS 16949, ISO14001, ISO13485 and OHSAS/TIS18001 certified.



Employing over 4,500 personnel and using SPC and MRPII, MES, PLM systems, Hana Lamphun is equipped with fully automated machinery for advanced Chip-On-Board (COB), Chip-On-Flex (COF), Flip-Chip (F/C) Surface-Mount-Technology (SMT), Printed Circuit Board Assembly (PCBA), Opto Electronics assembly, Hybrid Modules Assembly and others assembly services. We strive to consistently upgrade our facilities and maintain them to the highest standards and to provide an excellent service to meet customer expectations. ZERO defect mindset is our primary quality standpoint.


Technology of Electronics Assembly:


COB    Fully automatic gold ball bond and Aluminum wedge bond various
             wire types, up to 5,000 wires

SMT    Fine-pitch down to 8 mils, 01005 chip components BGA, QFN,
            QFP attach

Test    Full range of In-circuit test & RF test & functional test





SMT & Flip Chip

SMT & Flip Chip Hana Microelectronics Lamphun’s Electronic Manufacturing Services include an extensive array of SMT and Flip Chip technologies. Many or our capabilities are considered proprietary and not listed on the website. For more information on our SMT and Flip Chip capabilities, please contact one of our technical representatives. Solder Paste Screen Printing
  • Laser cut & Electroform stencil size 29” x 29”
  • Printing accuracy +/-15 um
Component Mounting
  • Board dimension: 50x50 to 760x460
  • Handling package: reel, tube, waffle tray.
  • Chip component size: 01005 (smallest chip comp size)
  • QFP 0.4mm pitch/54 x 54 mm
Auto Inspection
  • Methodology: Scanning and Image capture
  • Board dimension: 250x330 mm. Max.
  • Component Size: Chip 01005
  • Image resolution: 18 um
X-ray Inspection
Solder Bump Placement
  • Handle Packages: waffle tray, Tape & Reel
  • Board dimensions: 50x50 to 510x510
  • Die Size: 0.5x0.5 mm to 11x11mm
Flip Chip bonding
  • Gold-Gold Interconnect
  • C4 Flip Chip Process
  • Die size: 0.8 x 3.0 mm ( Standard ), 0.3 x 0.3 mm ( Option )
  • Substrate handling: PCB , Ceramic , Glass , Lead frame
  • Max wafer: 6 Inches
Underfill
  • Working area 22 x 22 inch
  • Weight scale measurement

Final Assembly

Final Assembly Capability Below are just a few of our Electronic Assembly capabilities. For more information, please contact one of our technical representatives.
  • Wave Soldering
  • Auto Selective Wave Soldering
  • Pulse Heated Reflow Soldering
  • Hand soldering
  • Re-Soldering
  • Adhesive Bonding
  • Routing
  • Singulation
  • Laser Marking

COB

Chip on Board (COB) Capabilities Below are some of our COB capabilities that are part of our Electronic Manufacturing Services. For more information regarding our technologies or capabilities, please contact one of our technical representatives. Wafer Back Grinding
  • Wafer diameter 6” & 8”
  • Tape mounter
  • Non contact thickness measuring
Wafer Screening
  • 8 & 12 Inches water handling
  • Epoxy thickness : 1.0 , 1.5 , 2.0 mil ( Varies design )
Wafer Dicing, Inspection and Tape & Reel
  • Full Automatic mc
  • Dual spindle
  • 2 “ Blade
  • CO2 Bubble
  • Dyma flow Chemical
  • Non contact wafer mounting
Wafer Inspection
  • Inspection method
    • Bright field & Dark filed
    • Multi color filter ( 5 difference )
  • Material handling
    • Wafer 8 inches maximum
  • Automatic import and layer mapping file.
Tape & Reel for wafer film frame
  • Inspection method
    • 3 inspection camera
    • 5S camera capability
  • Material handling
    • Wafer 8 inches maximum
    • Output Tape & Reel
  • Wafer mapping capability
Die attach
  • Die size
    • 6 x 6 mil – 400 x 400 mil
  • Substrate handling
    • W x L : 102 x 300 mm.
  • Stamping & Dispensing Type
  • Heater support
    • DAF , B-Stage
  • Electronic mapping
  • Max wafer 12”
  • Bridge support ( 2 Dies )
Eutectic Die Attach
  • Solder composition 80Au/20Sn
  • Temperature profile Programmable 320 degree Max.
  • Substrate 51 x 51 mm
  • Dual tool holder for Die and preform
  • Ultrasonic scrub with adjustable time, frequency and amplitude
  • Interchangeable heated work holder
Wire bond Process
  • Wire diameter
    • 0.6 – 2.0 mil
  • Material Handling
    • Gold , Cu , AuAg , CuPd
    • Stud bump
  • Substrate handling
    • W X L : 92 x 300 mm.
    • T : 0.2 – 0.9 mm.
    • Bonding area : 80 x 56 mm. ( X x Y )
Stud Bump
  • Wire diameter: 1 mil.(AW66)
  • Seat Diameter:- +/-5 um
  • Seat High: - +/- 4 um.
Manual Gold Wire Bonding
  • Thermosonic ball/wedge bond
  • Au wire: Round wire dia. 0.7-2.0 mils
  • Au Ribbon size: 0.5x10 mils
  • XYZ free movement
  • Deep access capability
Coating process
  • High machine accuracy
    • Linear X-Y Servo motor
    • Auto weight scale : 0.1mg minimum
    • Working area 120 x 260 mm.
  • Varies pump support
    • Auger Pump , Linear , Jet
Marking
  • Fiber laser, CO2 marking, UV laser mark, IR laser mark.
  • Full automatic loading
  • Black / Clear compound
  • LCP , PCB , Ceramic



The Microelectronics Division presently provides manufacturing services for the following products:

  • Computer Mouse Sensor
  • Commercial products
  • Telecommunication modules
  • Automotive Sensors
  • Automotive LED assembly
  • Computer input Devices
  • Medical Devices
  • Smart Cards modules

















HANA Lamphun plant 1

Certification Certification Body Certificate No. Original Certification Date
ISO 9001:2008 SGS TH10/5267 July 1995
ISO/TS 16949:2009 SGS TH10/5266 December 1998
ISO 13485:2003 SGS GB07/72438 May 2007
ISO 14001:2015 SGS TH08/1526 November 1999
OHSAS 18001:2007 SGS TH08/1527 May 2005
TIS 18001:2554 SGS TH08/1529 May 2005



HANA Lamphun plant 2

Certification Certification Body Certificate No. Original Certification Date
ISO 9001:2015 SGS TH15/9026 November 2015
ISO 14001:2015 SGS TH15/9027 November 2015
OHSAS 18001:2007 SGS TH15/9028 November 2015
TIS 18001:2554 SGS TH15/9040 November 2015




Hana Microelectronics Public Co., Ltd.

Address No. EPZ Northern Region Industrial Estate 101/2 Moo 4, T. Baan-Klang, A. Muang Lamphun 51000, Thailand


Phone: +66 (53) 581 565 -72

Fax: +66 (53) 581 573 -74, 581 290

Sales & Marketing: WK Chow

wkchow@lpn.hanabk.th.com

Hana Microelectronics Inc (USA)

Sanjay Mitra

smitra@hanaus.com

Phone: (408) 452-7474