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SOIC PACKAGE

SOIC : Small Outline Integrated Circuit Package
Package Type Lead Count
150 mils
8/14/16
300 mils 16
SOIC
Lead Frame
: C194 Cu lead frame, PPF is optional
Die Attach
: Ablebond 84-1 LMISR4, Ablebond 843J. Ablebond 2200D for Green Package
Wire : 1.0, 1.25, 1.3, 1.5 and 2.0 mils
Mold Compound : MP8000AN/CH. G600 for Green Package
Mark : Laser
Lead Finished : Solder or 100% Tin Plate
Packing : Antistatic Tube or Tape & Reel
Package Outline
Click lead count to view Package Outline
150 mils - 8 / 14 / 16 L
300 mils - 16 L