Semiconductor facility-Ayutthaya

SEMICONDUCTOR PACKAGING AND ASSEMBLY


Hana Semiconductor (Ayutthaya) Co., Ltd. established in 1997 specializes in the IC assembly and test of low to medium pin count IC’s. We offer state of the art assembly processes (including Copper Wire, Chip on Lead, Multi-Die, Stacked Die, Clear Molding etc.) and test solutions. Our “leadless” package size starts from a 2 pin 0.6 x 0.3 mm to our popular package size of 40 pin 12x12 mm. Our leaded packages starts from our SOT963 with foot print of 1x1 mm to standard 24L SOIC.


Besides standard packages, we also work with our customers closely to design and develop custom package solutions to address their specific needs. We provide custom package solutions for the MEMS, SENSORS, SIP (System in Package) and Hybrids/SMT, Multi-chip Modules, Isolation/Optocouplers, RFID/HOA, Optoelectronics and Clear Optical packages. Total installed capacity within Hana for IC packaging is ~ 20 million units per day and 80% of this is tested at Hana.


Hana Semiconductor (Ayutthaya) Co., Ltd is ISO9001, ISO/TS 16949, ISO14001 and OHSAS18001 certified and products are RoHS compliant.


Coupled with on-going training programs initiated to enhance technical skills and TQM (Total Quality Management) techniques, our factory personnel have attained an awareness and maturity to compete aggressively in today's competitive environment.






Hana Ayutthaya presently provides manufacturing services for the following products:

  • IC assembly and Final test
  • Wafer Test
  • 12 “ Wafer capability
  • Die Sort Visual
  • Soft solder die bonder
  • Ag Wire, Cu Wire, Cu Clip, Al Ribbon bonding
  • Al Heavy wedge bonding
  • Flipchip with Cu pillar bump
  • Auto Visual Inspection
  • TO Can
  • Optical Sensors technology
  • Proximity Sensor
  • UV Sensor
  • Automotive Sensor
  • MEMs Sensor
  • Smart card chips
  • Analog / Linear Devices test
  • Logic and Memory Devices test
  • Mixed-Signal Devices test
  • Power MOSFET and Transistor (Discrete) test
  • Opto-Coupler Devices test and High Voltage test
  • ASIC (Application Specific IC) test
  • MEMS, SENSORS and SIP test
  • RF Test


Please contact us at info-request@hanaus.com for more details and we look forward to working with you and providing you state of the art IC Assembly and Test solutions to service your needs.

PACKAGES SERVICE
PDIP : Plastic DUAL IN Line Package
SOIC : Small Outline integrated Circuit Package
MSOP : Mini Small Outline Package
VSOP : Very Small Outline Package
SC : Small Outline Transistor
SOD : Small Outline Diode Package
SOT : Small Outline Transistor
DFN/QFN : Dual/Quad Flat No Lead Package
LGA : Land Grid Array Package
ODFN/OQFN : Optical DUAL/Quad Flat Non Lead


Certification Certification Body Certificate No. Original Certification Date
ISO 9001:2008 SGS TH06/3370 August 1994
ISO/TS 16949:2009 SGS TH06/3318 May 2003
ISO 14001:2004 BVQI TH007528 October 1999
OHSAS 18001:2007 BVQI TH008726 May 2013

Hana Semiconductor (Ayutthaya) Co., Ltd.

Hi-Tech Industrial Estate Authority of Thailand
100 Moo 1, T. Baan-Len, A. Bang Pa-In KM. 59
Asia Road, Ayutthaya 13160, Thailand

Tel: +66 (35) 729 300 (Auto 10 lines)
  Tel: +66 (35) 350 803 , 350 970-2
Fax: +66 (35) 350 805-6
Sales & Marketing Tappawong N.

Tappawong@ayt.hanabk.th.com
Taiwan/ Korea/ Japan : Peter W. Hwang

peterw@ayt.hanabk.th.com
USA/ Europe/ Other Countries : Sanjay Mitra

smitra@hanaus.com

Phone: (408) 452-7474